Audited Supplier 
BYK-W-9010
Wetting and dispersing agents for SMC/BMC and pultrusion molding compounds. Low profile (LP) and low shrinkage (LS) for pigment filler filling, as well as reduced system viscosity in high-packed epoxy formulations. Not suitable for cobalt boosting systems. For low-volatility formulations.
| Typical Properties | |
| Acid value | 129 mg KOH/g |
| Density (20 °C) | 1.16 g/m |
| Refractive index (20 °C) | 1.469 |
| Water content | 0.0002 |
| Active substance | 1 |
Application
SMC, BMC, Pultrusion
Special features and benefits
Solvent-free wetting and dispersing additive (100% active substance) to wet inorganic fillers (and inorganic pigments) in systems in which solvents need to be avoided.
Adhesives & Sealants
Special features and benefits
Solvent-free wetting and dispersing additive (100% active substance) to wet inorganic fillers (and inorganic pigments) in systems in which solvents need to be avoided.
Special features and benefits
Solvent-free wetting and dispersing additive (100% active substance) to wet inorganic fillers (and inorganic pigments) in systems in which solvents need to be avoided.
Adhesives & Sealants
Special features and benefits
Solvent-free wetting and dispersing additive (100% active substance) to wet inorganic fillers (and inorganic pigments) in systems in which solvents need to be avoided.
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